Electromagnetic compatibility test

EMCEquipment and tes☆¶π¥t capacity provided fo≈®↔r EMB laboratory:

1.It has a semi-anec×δ¥hoic chamber and one set of e'€↔ lectromagnetic disturbance equipment t∏§™βhat comply with CISPR25, which can be♠← used for the test of raβ©diation emission (RE), conducte≈♥∏d emission voltage m®≈§♥ethod (CEV) and conducted φ&emission current probe met←₹hod (CEC).

2. It has a semi-an  &echoic chamber and one set of r★γ>adiation immunity and hand-held emiγ↔δssion immunity test equipment that c©δ↓omply with ISO 11452-2/9, wh‍וδich can be used to test radia ←tion immunity free field meλ♥' thod (RI) and radar wave emit♣♠ter immunity (PTI).

3. It has one shielding room and on×£∑e set of bulk current injection'•♠ and magnetic field iγ  ®nterference resistance test equipme​§nt that complies with ISO 1145§←©→2-4/8 standards capable of performi∑₹®ng radiate susceptibi​↓₽φlity -bulk current in®♠♥jection (BCI) and lo£σ>w frequency magnetic field immuni'α‍αty (MFI) tests.

4. It has one set of transient immu φnity test equipment and ✔♣≈πone set of transient conducted emiss"≠∏σion equipment in accordan±¶ ce with ISO 7637 standards, whi÷ ‍∑ch can test power co≈↔σ±rd transient conducted immunity (CIP), ≤¶♦signal line coupling/inductive cond ♥÷uction immunity (CIS) an±δ∑¶d transient conducte>Ω∞←d emission (CTE).

5. It has a shielding room ←♥₹Ωand a set of electrostat™&ic discharge equipment that m>'eets ISO 10605 standards capable σλof conducting electrostatic discharge§≠ (ESD) tests.

Environment tests

Major test capacity: high/lo✔β↕→w-temperature test, thermal shock test,₩ "₩ humidity and heat test, t​₹δ×emperature cycle test☆α≥', etc, which will satisfy e "→nvironment reliability test♥™s of Volkswagen, General Motors, SA₹♦≈IC and other car makers.

Equipment capacity: There are→↔ 12 sets of testing equipment, whic​✘h mainly consists of 10 sets of weather∞÷↕ test chambers and 2 sets ✔σ÷λof thermal shock test cham₩★bers.

Photoelectric analy©​sis and measurement

Major test capacity: It is ₹​™∑used to test and analyze comprehen<↕sive characteristics ↑​of light, color, electricity o☆₩f high power integrated packag♠→ed LED and LED modules and other produ••cts under different s£↔hell temperatures, relative spectr♦‌∞↑al power distribution, ∑σ chromaticity coordiλεβnates, main wavelength, §£•peak wavelength, spec≤♣↓λtral purity, color temperature, color '♠rendering index, half width, ♠£♥luminous flux, radiant ¥α power, red color tolerance, current, γφδ‍voltage, power, etc.

Equipment capacity: It has two sets≈♥ of HAAS-2000 high accuracy quicδ ∏&k spectrum radiometers, one↓ε set of ATA-1000 automatic tempe®→££rature control photoelectric anaπ∞'lysis and measurement s÷ ¥ystem.

Size measurement

Major measurement capacity: Acco♣σrding to the requirements for de​≈sign drawings, the traditional dimensiε♣δ©onal inspection such as form and ♠→  position tolerance of sampγ₽€♠les is carried out; non-contact scan≥‍♠ning data will be compar↑£ed with the product design Ω‌&¥CAD models, and the full-scale detec✘↓φtion of the scanning point cloud is÷≈ $ performed; and the 3D solid mode£δ∞ling of the scanning data is cγ δonducted.

Equipment capacity: It has blue≥φ™γ light scanner ATOS core £↑300, hand-held probe 3-coordinat≥÷Ωδe XM1200, image coordinate m☆>easuring instrument ↑≤GVC2M and other measuring equ←σipment.

Metallographic analysis

Major test capacity: Slice ana∏✘σ©lysis/metal coating t↔ hickness measurement; ✔↔™according to IPC-TM-650, IPC-A-610,‌↕λ♦ IPC-6012, GM3172-2018 and as rβ♠equired by customers, to carry &£out destructive inspection on the in≈Ωternal structure and mutual matching ofσ‍ components, carry out the measδ↑≠urement of metal coatings, IM✘↑¶♥C thickness and solder void×$™≠ rates.

Equipment capacity: It is provided wit✔♣ h 1 set of automatic precision cutting↓σ machine JMQ-60Z, 2 se≥✘∏ts of metallographic speci•↓♠men polishing machine™↑φs PG-2B and 1 set of ZEISS•→↕ optical microscope VertA1.

Noninvasive detection

Major test capacity: Used ←™€to monitor whether there is ₩π≥φany abnormality in the internal  ®‍bonding wire structure of w•​ithin LED package and SMT worksh€✘op process control; for any failure >↓σεstate that can not be display₩€‍¶ed by 2D perspective, it♥©≠ can be presented by mea→↔ns of tomography with three-v∏ iew observation of in≥≈§™ternal structures; nondβ$estructive failure analysis o>∑<bservation and measu​ ♥♠rement of coating film thickness sizes,™'λ₽ etc.